packaging

Contract packaging services for ICs and discrete semiconductor devices are available at Mikron manufacturing facilities in Moscow, Russia and in Shenzhen, China.

IC PACKAGING

Contract packaging services for ICs and discrete semiconductor devices are available at Mikron manufacturing facilities in Moscow, Russia and in Shenzhen, China.
Standard analog ICs are packaged into the following package types:
• SOP-8/14/16/28L
• SSOP-24L
• SOT-23
• TSSOP-20L

Shenzhen assembly fab possesses high-end ASM and Kulicke&Soffa packaging equipment with the capacity of up to 140 million plastic packages per month, including:
• Die attaching equipment (19 pieces)
• Wire bonding equipment (90 pieces)
• Molding, packaging and laser beam marking equipment
• Test and measurement equipment to control the packaging results (17 pieces)

Smart card assembly and personalization 

Mikron offers smart-card assembly and personalization services at the Mikron production facilities in Moscow, Russia.
Mikron produces both simple non-rechargeable paper cards (tickets) and feature-rich rechargeable plastic smart-cards, including microprocessor bankcards and SIM-cards.
The production cycle includes all steps that begin with the chip design and continue through wafer production and into inlay / label / smart-card assembly and personalization. Both contact and dual interface smart-cards can be assembled by Mikron.
Manufacturing capacity: 50 million pieces a month.  
Mikron’s EMV-card assembly and personalization facilities are fully compliant with Visa and MasterCard security requirements. The highest security level is validated by regular successful audits.